|
MIL-PRF-55110 ; MIL-P-50884
; MIL-PRF-31032 ; IPC-TM-650
|
|
SPECIFICATION /PARAGRAPH
|
TEST NAME
|
|
MIL-PRF-55110
|
WHOLE SPECIFICATION |
|
MIL-P-50884
|
WHOLE SPECIFICATION |
| MIL-PRF-31032 |
WHOLE SPECIFICATION |
| IPC -TM-650 |
IN ADDITION TO THE ONES USED IN THE ABOVE MENTIONED SPECIFICATIONS |
| 2.2.17 |
SURFACE ROUGHNESS & PROFILE OF METALLIC SURFACES |
| 2.4.1 |
ADHESION TAPE TEST |
| 2.4.1.1 |
ADHESION MARKING PAINTS & INKS |
| 2.4.1.2 |
ADHESION OF CONDUCTORS ON HYBRIDS |
| 2.4.1.3 |
ADHESION OF RESISTORS ; HYBRID CIR. |
| 2.4.1.6 |
ADHESION OF POLYMER COATINGS |
| 2.4.12 |
SOLDERABILITY EDGE STRIP |
| 2.4.13 |
SOLDER FLOAT RESISTANCE FLEXIBLE PRINTED WIRING MATERIAL |
| 2.4.13.1 |
THERMAL STRESS OF LAMINATES |
| 2.4.14 |
SOLDERABILITY OF METALLIC SURFACES |
| 2.4.18 |
TENSILE STRENGTH , ELONGATION OF CU. FOIL |
| 2.4.19 |
TENSILE STRENGTH, ELONGATION FLEXIBLE PRINTED WIRING |
| 2.4.20 |
TERMINAL BOND STRENGTH : FLEX CIR. |
| 2.4.21 |
LAND BOND STRENGTH : UNSUPPORTED COMPONENT HOLES |
| 2.4.21.1 |
BOND STRENGTH ; SURFACE MOUNT LANDS PERPENDICULAR PULL METHOD |
| 2.4.27.2 |
SOLDER MASK ABRASION ( PENCIL METHOD) |
| 2.4.28 |
ADHESION, SOLDER MASK ( NON-MELTING METHOD) |
| 2.4.28.1 |
ADHESION, SOLDER RESIST (MASK) TAPE TEST |
| 2.4.40 |
INNERLAYER BOND STRENGTH OF MULTILAYER P.C. BOARDS |
| 2.5.3 |
CURRENT BREAKDOWN PLATED THROUGH HOLES |
| 2.5.9 |
INSULATION RESISTANCE ; FLEXIBLE PRINTED WIRING |
| 2.5.10 |
INSULATION RESISTANCE ; MULTILAYER P.W.B ; MOISTURE |
| 2.5.11 |
INSULATION RESISTANCE ; MULTILAYER WITHIN LAYERS |
| 2.5.12 |
INTERCONNECTION RESISTANCE |
| 2.5.16 |
SHORTS , INTERNAL ON MULTILAYER PWB. |
| 2.5.17 |
VOLUME & SURFACE RESISTIVITY OF P.W. LAMINATES |
| 2.5.23 |
INSULATION RESISTANCE & MOISTURE RESISTANCE OF SOLDER
MASKS |
| 2.5.27 |
SURFACE INSULATION RESISTANCE OF RAW P.W.B |
| 2.5.32 |
RESISTANCE TEST, PLATED THROUGH HOLES |
| 2.6.3.3A |
SURFACE INSULATION RESISTANCE / FLUXES |
| 2.6.6 |
TEMPERATURE CYCLING : P.W.B |
| 2.6.11 |
HYDROLYTIC STABILITY SOLDER MASK & CONFORMAL COATING. |
| 2.6.12 |
TEMPERATURE TESTING, FLEXIBLE FLAT CABLES |
| 2.6.13 |
ASSESSMENT OF SUSCEPTIBLITY TO METALLIC DENDRITIC GROWTH OF
UNCOATED PRINTED WIRING |
| 2.6.17 |
HYDROLYTIC STABILITY, FLEXIBLE P.W |
| 2.6.19 |
ENVIRONMENTAL & INSULATION RESISTANCE OF HYBRID CERAMIC
MULTILAYER SUBSTRATE BOARDS. |
| 3.1 |
CONTACT RESISTANCE CONNECTORS |
| 3.3 |
CRIMP TENSILE STRENGTH , CONNECTORS |
| 3.5 |
INSULATION RESISTANCE : CONNECTORS |
| 3.10 |
SOLDERABILITY , CONNECTORS |
| 3.11 |
THERMAL SHOCK ; CONNECTORS |
| 3.13 |
DIELECTRIC WITHSTANDING VOLTAGE ; CONNECTORS |
| 3.14 |
HIGH TEMPERATURE LIFE ; CONNECTORS |
| 3.18 |
MATING & UN MATING FORCE ; CONNECTORS |
